T527系列芯片是全志旗下的高性能八核AIoT SoC，适用于收银结算、工业应用和汽车电子。该芯片系列集成了八核Cortex-A55CPU，一个HiFi4 DSP，2个顶级NPU，G57 MC1 GPU，32位DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X DRAM，高速接口（PCIe2.1和USB3.1）、汽车接口（CAN）、多视频输出接口（2*RGB/2*Dual LVDS/2*MIPI-DSI/HDMI/eDP）和视频输入接口（MIPI CSI）。芯片内置4K@60fpsH.265解码器，4K@30fpsH.264解码器，1080p@60fpsH.264编码器，DI和SmartColor系统，为用户提供流畅的体验和专业的AI视觉效果。T527系列可用于内容共享和自助交互终端，智能制造以及其他电子商业和工业设备。
Features
全志T527 SoC功能框图
Processor
● Octa-core ARM CortexTM-A55, up to 2.0 GHz
● RISC-V CPU, up to 200 MHz
● HiFi4 Audio DSP
● ARM G57 MC01 GPU
● Up to 2 Tops NPU
Memory
● 32-bit DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X interface, supporting maximum capacity of 4
GB
● 4 chip select lines for LPDDR3, LPDDR4, and LPDDR4X (especially the 64-bit LPDDR3, LPDDR4, and
LPDDR4X)
● SD3.0/eMMC5.1 interface
Video Engine
● H.265 MP and VP9 decoder up to 4K@60fps
● H.264 BL/MP/HP decoder up to 4K@30fps
● H.264 BP/MP/HP encoder up to 4K@25fps
● MJPEG encoder up to 4K@15fps, JPEG encoder up to 8K x 8K resolution
Video Output
● Two dual-link LVDS interfaces, up to 1080p@60fps
● Two RGB interfaces with DE/SYNC mode, up to 1080p@60fps
● eDP 1.3, up to 2.5K@60fps and 4K@30fps
● 4+4-lane MIPI-DSI output interface up to 2.5K@60fps and 4K@45fps
● HDMI2.0 TX interface, supporting HDCP1.4
Video Input
● 8/10/12/16-bit parallel CSI, supporting BT.656 up to 4*720P@30fps and BT.1120 up to
4*1080P@30fps
● 4+4-lane, 4+2+2-lane, or 2+2+2+2-lane MIPI CSI, up to 2.0 Gbit/s per lane in HS transmission,
compliant with MIPI-CSI2 V1.1 and MIPI DPHY V1.1
● Maximum video capture resolution of 8M@30fps for MIPI CSI
Audio
● 2 DACs and 3 ADCs
● 3 x audio outputs: LINEOUTLP/N, LINEOUTRP/N, HPOUTL/R
● 3 x audio inputs: MICIN1P/N, MICIN2P/N, MICIN3P/N
● 4x I2S/PCM external interfaces: I2S0, I2S1, I2S2, and I2S/PCM3
● Maximum 8 digital PDM microphones (DMIC)
● One OWA RX and one OWA TX, compliance with S/PDIF interface
External Peripherals
● 1 x USB2.0 Host, 1 x USB2.0 DRD, 1 x USB3.1 DRD&PCIe2.1 Combo
● 2 x GMAC (10/100/1000 Mbps port with RGMII and RMII interfaces)
● 2 x CIR RX, 1 x CIR TX, 9 x TWI, 4 x SPI, 10 x UART, 2 x CAN
● 30-ch PWM, 24-ch GPADC, 2-ch LRADC
● SDIO 3.0, LEDC, SPIF (Octal I/O)
Security System
● AES, DES, 3DES, and SM4 encryption and decryption algorithms
● MD5, SHA, and HMAC tamper proofing
● RSA, ECC signature and verification algorithms
Package
● HS-FCBGA 664balls, 17 mm x 17 mm size, 0.5 mm ball pitch, 0.3 mm ball size
全志T527典型应用框图
