一款采用英特尔六代凌动Elkhart Lake细列处理器的SOM嵌入式系统核心板，专为物联网和边缘计算设计。支持Windows10 IoT、Windows 10 、Ubuntu、Yocto等操作系统，采用B2B高速连接器，方便自行设计底板进行功能拓展，非常适合行业项目的二次开发。
Features
● Quad-core Intel Atom®Processor SoC, Burst Frequency up to 3.0GHz
● Intel®Gen11 LP GFX for AI inference based on OpenVINO
● In-band ECC, up to 16GB LPDDR4 at up to 4267 MT/s
● TCC and 2.5GbE with TSN
● Real-time I/O via ARM Cortex-M7 processor
● USB 3.2 10Gbps
Specifications
● Core System
CPU 6th Gen Intel Atom® Processor (formerly “Elkhart Lake”)
• Intel Atom® x6425E 1.8GHz (3.0GHz Burst) 12W (4C/32EU, IBECC/non-ECC)
• Intel Atom® x6413E 1.5GHz (3.0GHz Burst) 9W (4C/16EU, IBECC/non-ECC)
• Intel Atom® x6211E 1.2GHz (3.0GHz Burst) 6W (2C/16EU, IBECC/non-ECC)
• Intel Atom® x6200FE 1.0GHz 4.5W (2C/No GPU, IBECC/non-ECC)
• Intel Atom® x6425RE 1.9GHz 12W (4C/32EU, IBECC/non-ECC)
• Intel Atom® x6414RE 1.9GHz 9W (4C/16EU, IBECC/non-ECC)
• Intel Atom® x6412RE 1.5GHz 6W (2C/16EU, IBECC/non-ECC)
Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64
Architecture, Execute Disable Bit, Intel® AES-NI, PCLMULQDQ Instruction,
Memory
LPDDR4 soldered memory up to 4267 MT/s, IBECC/non-ECC up to 16GB
Memory configuration: 2/4/8/16GB (8/16GB by project basis)
In-Band ECC (IBECC), provides ECC protection without additional ECC device(dependent on SoC SKU)
Embedded BIOS
AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (dual BIOS by build option)
Cache
TBC
Expansion Busses
• 4 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4)
• LPC bus, SMBus (system) , I2C (user)
SEMA® Board Controller
Supports: Voltage/current monitoring, power sequence debug support,T/ATX mode control, logistics and forensic information, flat panel control,general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)
Debug Headers
30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power
testpoints, debug LEDs
● Video
GPU Feature Support
Intel® Gen11 LP Graphics Core Architecture, supporting multiple
independent and simultaneous display combinations of DisplayPort/HDMI/
LVDS or eDP outputs (max. 4K @60Hz)
• Hardware encode/transcode of HD content (including HEVC)
• DirectX 12 and Vulkan v1.1 support
• OpenGL 4.5 and ES 3.2 support
• OpenCL 1.2 support
Digital Display Interface
DDI0 supporting DisplayPort/HDMI/DVI
LVDS
Single channel 18/24-bit LVDS via eDP-to-LVDS IC
(max. resolution 1920×1200 @60Hz in dual mode)
eDP
Optional 4 lane support, in place of LVDS
(max. resolution 4096×2160 @60Hz)
● Audio
Chipset
Intel® HD Audio integrated in SoC
Audio Codec
Located on carrier miniBASE-10R
● Ethernet
Intel® MAC and external PHY
MaxLinear GPY series PHY (GPY 211/215)
TSN support on Linux
Interface
2.5Gbit/s and 1000/100/10 Mbit/s Ethernet connection
GbE0_SDP available if TSN support enabledSpecifications
● I/O Interfaces
USB: 2x USB 3.2/2.0/1.1 (USB 0,1,) and 6x USB 2.0/1.1 (USB 2,3,4,5,6,7)
SATA: 2x SATA 6Gb/s (SATA 0,1)
Serial: 2x UART ports with console redirection
eMMC: eMMC 5.0 (16/32/64GB by build option), functions as boot-up device
(TBC)
GPIO/SD: 4x GPO and 4x GPI from EC (GPI with interrupt TBC)
SD/GPIO muxed design, SD is build option by project basis, SD functions as
storage device only
Notes: USB 3.2 Gen2 support dependent on carrier design.
2x UART and 8x GPIO can be managed by ARM M7 processor or x86 processor. UART, GPIO managed by ARM M7 is for real-time usage.
CAN FD (build option by project basis, shared with UART 1) is managed by ARM M7 processor for real-time usage (TBC).
● Super I/O
Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis)
● TPM (build option)
Chipset: Infineon
Type: TPM 2.0 (SPI based, build option by project basis)
● Power
Standard Input
ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%
Wide Input
ATX: 4.75-20 V / 5Vsb ±5%; or AT: 4.75-20V
Management
ACPI 5.0 compliant, Smart Battery support
Power States
S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
ECO mode
Supports deep S5 mode for power saving
● Mechanical and Environmental
Form Factor: PICMG COM.0: Rev 3.0 Type 10
Dimension: Mini size: 84 mm x 55 mm
Operating Temperature
Standard: 0°C to 60°C (storage: -20°C to 80°C)
Extreme Rugged: -45°C to +85°C
(optional, selected SKUs; storage: -40°C to 85°C)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
● Operating Systems
Standard Support
Windows 10 IOT Enterprise 64-bit, Windows 10 64-bit, Yocto Linux 64-bit,
VxWorks 64-bit (TBC), Ubuntu (TBC)
Extended Support (BSP)
Yocto project based Linux 64-bit